Weight

The testing section of the Cubesat 5000 will consist of different material compositions to figure out which material will be the lightest however the weight requirement will likely be the last to be tested as it is already unlikely to pass requirement.   It is also more important the functionality of the Cubesat 5000 remain and it is able to still function with a heavier weight, it just decreases functionality.

For the weight requirement, the final and complete assembly will be placed on a scale and weighed to determine to total weight.  If the assembly is too large to fit on the scale the individual components will be weighed instead.  This is the secondary option since there is room for error in the form of glue or tape that will be needed to insulate the foam and secure the internal panels.

Cold resistance 

The temperature resistance will be tested however all testing plans had to be changed to to the political and heath issues during this time period.  While the initial testing concepts included using freezers, dry ice, or liquid nitrogen all plans were changed.  

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Testing ended up taking place in a personal residence using the materials available.

 

See results page for results.  

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Impact

The Cubesat 5000 paneling will go through impact testing and deflection testing to determine if it will be able to survive the impact and if the deflection of the material is sufficient to protect the internal electrical components.

For impact the filament will be tested to determine it elastic and rigidity properties.  This was initially

 planned to happen within the CWU materials lab with several weights however these plans needed to change after the campus was closed. 

 

In order to adapt the testing was done in a personal residence using a single weight.  The data collected was changed from the initial plan of using impact and instead used energy.  This is because energy can be collected using a single weight and different energy levels (heights).    

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See results page for results. 

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Mounting 

In order to secure the electronics the mounting mechanisms needs to hold the paneling and electronics in place.   The orginal plan for the mounting was mounting spikes that would have been 3D printed on the internal paneling however, these did not print successfully and therefore needed to be redesigned.  

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The redesign consisted of using paperclips that were shaped and cut into approximately 1.5 inch arcs.  These arcs are then through the outer most holes in the internal panels and pushed into the insulation. 

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See results page for results. 

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